Stacked Fin Heatsinks
Heatscape’s custom stacked fin heat sink solutions offer better performance when compared to typical extrusion heatsinks, due to thinner fin profiles leading to higher surface area and lower pressure drop. With our advanced engineering and manufacturing expertise, Heatscape has been able to cool some of the most demanding thermal challenges in the telecom, networking, and electronics industries.
By embedding heatpipes into the base of a heatsink, the spreading capability of the base, and therefore the overall heatsink performance can be greatly improved. In addition, evaporator/condenser heatpipe assemblies can also be used to move heat from a high powered component in a tightly constrained area, to a region where a larger, more conductive fin array can be placed. Heatscape a heat pipe manufacturer specializes in incorporating heatpipes into a variety of thermal solutions.
Custom Vapor Chamber Heat sinks
Today’s CPUs, GPUs, and high performance ASICs are continually increasing their capacity, speed, and power, while being placed into smaller and more compact form factors, leading to increased power density. This leads to greater challenges from a thermal management perspective. Vapor Chamber Heat sinks, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for these applications. Heatscape’s engineering team can deliver custom vapor chamber heat sinks solutions in custom sizes and shapes, including single and multi-stepped vapor chamber bases.
Aluminum Extrusion Heat Sinks
Aluminum extrusion heat sinks are an effective way to cool heat producing components in a cost-effective manner. High-end custom extrusion designs can be used for more thermally challenging applications, while simpler straight-fin or cross-cut fin designs can be used for lower powered ones. Aluminum extrusion heat sinks can also be customized with embedded heat pipes, captive mounting hardware, and color anodizing.
Active Heat Sinks
Our active heat sinks can be custom built according to your needs. With the rising functionality and computing power of graphics boards and GPUs comes greatly increased thermal challenges. Heatscape has designed, developed, and manufactured numerous graphics card thermal solutions for both 1-slot and 2-slot products using a variety of innovative methods. Independent floating core solutions are also available for use in dual GPU applications to alleviate tolerance issues associated with the heights of the 2 chips.
Skived Fin Heat Sinks
Skiving is a manufacturing process where thermal solutions are formed by shaving one solid block of copper or aluminum into a finned heatsink. This method eliminates the resistance layer that is present with the solder layer in stacked fin heatsinks since skived fins are built from a single piece of metal. Skived fin heatsinks also require minimal tooling charges, which makes it a cost-effective solution. Skived heatsinks can also be customized with embedded heatpipes to add a performance boost if needed.